LAUSR

A 3D integrated hybrid silicon laser was realized for high-thermal performance by integrating silicon photonic (SiPh) chips and indium phosphide (InP) chips. The optical gain is provided by the InP chip with a total internal reflection mirror for surface emission. The surface grating couplers on the SiPh chip couples light into a silicon waveguide. The InP chips were flip-chip bonded P-side down to metal pads on the silicon chips. Two lasers are reported. For laser A, the InP chip was bonded on the top cladding oxide of the silicon waveguide. For laser B, the InP chip was bonded to the silicon substrate in an etched recess. Both lasers demonstrate milliwatt-level light coupled into the silicon waveguide. Laser B demonstrated three times better thermal performance with a measured thermal impedance of 6.2 °C/W.