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This special issue provides an overview of the foundational advances enabling 3-D monolithic systems, reports on exciting new advances, and identifies open opportunities and challenges. Click to show full abstract
This special issue provides an overview of the foundational advances enabling 3-D monolithic systems, reports on exciting new advances, and identifies open opportunities and challenges.
Keywords:
vertical future;
future electronics;
going vertical
Journal Title: IEEE Micro
Year Published: 2019
Link to full text (if available)
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Journal Title: IEEE Micro
Year Published: 2019
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!