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This article outlines a number of inkjet-/threedimensional (3-D)-printed prototypes of RF and millimeter-wave (mmW) components, interconnects, and systems. We pay special attention to the major challenges related to applying current… Click to show full abstract
This article outlines a number of inkjet-/threedimensional (3-D)-printed prototypes of RF and millimeter-wave (mmW) components, interconnects, and systems. We pay special attention to the major challenges related to applying current multidimensional printing technologies to the fabrication of flexible multichip modules (MCMs) and high-performance mmW components.
Keywords:
components interconnects;
printing new;
new applications;
millimeter wave;
interconnects systems;
exploring printing
Journal Title: IEEE Microwave Magazine
Year Published: 2018
Link to full text (if available)
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Journal Title: IEEE Microwave Magazine
Year Published: 2018
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!