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Low-Resistance Soldered Joints of Commercial 2G HTS Wire Prepared at Various Values of Applied Pressure

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In this study, we prepared soldered joints of 2G HTS wires from three different manufacturers: SuNAM, SuperPower, and SuperOx. We used Pb39Sn61 solder and varied the pressure applied on the… Click to show full abstract

In this study, we prepared soldered joints of 2G HTS wires from three different manufacturers: SuNAM, SuperPower, and SuperOx. We used Pb39Sn61 solder and varied the pressure applied on the joint during soldering in the 3.9–10.5 MPa range. We found that for all samples, joint resistivity decreased with increasing applied pressure. Practically important, very low joint resistivity values in the 10–15 nΩ·cm2 range were reproducibly achieved in joints made with SuperPower and SuperOx wire. Resistivity of joints made with SuNAM wire was rather high, in the 40–90 nΩ·cm2 range. No degradation in Ic across joints occurred in joints made at up to 8 MPa applied pressure. In joints made with SuperOx wire at applied pressure above 8 MPa, there was ${\text{I}}_{{\text{c}}}$ degradation comparing to the initial ${\text{I}}_{{\text{c}}}$ of individual wires before joining. We speculate on the possible reasons for the different resistivity and ${\text{I}}_{{\text{c}}}$ degradation behavior of joints made with wires from different manufacturers.

Keywords: applied pressure; wire; tex math; pressure; inline formula

Journal Title: IEEE Transactions on Applied Superconductivity
Year Published: 2018

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