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A Low-Latency and High-Endurance MLC STT-MRAM-Based Cache System

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Spin-transfer torque magnetic random access memory (STT-MRAM) is a promising cache memory candidate due to its high density, low leakage power, and nonvolatility. Multilevel cell (MLC) STT-MRAM can further increase… Click to show full abstract

Spin-transfer torque magnetic random access memory (STT-MRAM) is a promising cache memory candidate due to its high density, low leakage power, and nonvolatility. Multilevel cell (MLC) STT-MRAM can further increase density by storing 2 bits in one cell’s hard and soft domain, respectively. However, MLC STT-MRAM suffers two-step write, leading to high write energy, long latency, and severe lifetime degradation. Current encoding techniques propose to encode the new data to reduce the two-step data writes. However, they have two weaknesses: 1) high area overhead, e.g., recent work TSE (Hsieh et al., 2020) needs extra 37.5% MLCs and 2) prolong the write latency due to an extra read. Therefore, we propose enhanced one-step write (EOSwrite) to write data in one step. EOSwrite includes line bypassing and four intraline encoding techniques. Line bypassing schemes can bypass the writes to zero or clean lines, leading to low write/read latency. As for the intraline techniques, we propose four write modes. They utilize the data patterns and the clean data in cache lines to write data in one step, therefore reducing the data write latency. The key idea of one-step write is to write as much data as possible in the soft domain of MLC STT-MRAM. EOSwrite can greatly relieve the weaknesses of the current encoding schemes. Evaluation results show that EOSwrite can improve the lifetime of MLC STT-MRAM by 56.96%, reduce dynamic energy by 33.95%, reduce access latency by 36.95%, and improve system performance of MLC STT-MRAM by 4.30%, respectively. While the area overhead of EOSwrite is only 7.27%.

Keywords: mlc stt; latency; stt mram

Journal Title: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Year Published: 2023

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