Photo from academic.microsoft.com
With the emergence of new technical trends such as Internet of Things, Big Data, wearable electronics, automotive electronics, and 3-D printing, the role of electrical design of packages and package-based… Click to show full abstract
With the emergence of new technical trends such as Internet of Things, Big Data, wearable electronics, automotive electronics, and 3-D printing, the role of electrical design of packages and package-based systems is more important than ever. In addition to ongoing challenges to achieve higher integration density along with maintaining electrical integrity, multiphysics and low-power design requirements should be addressed. In order to provide solutions for upcoming applications and design challenges, novel ideas on design as well as advanced modeling approaches are continuously demanded.
Journal Title: IEEE Transactions on Components, Packaging and Manufacturing Technology
Year Published: 2018
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!