This brief introduces new methodologies to design microstrip line crossovers on a high-speed interconnection circuit. The crossover is based on a simple square patch, which employs TM100 and TM001 to… Click to show full abstract
This brief introduces new methodologies to design microstrip line crossovers on a high-speed interconnection circuit. The crossover is based on a simple square patch, which employs TM100 and TM001 to achieve mode orthogonality so that two sets of intersecting signals can transmit along microstrip lines with a high isolation. Compared with rectangular waveguide crossovers that employ high modes, namely TE102 and TE201, it shows advantages like a smaller size and easier manufacturing. Then, the relevant techniques for performance improvement, including radiation suppression and bandwidth widening, are studied for practical circuit designs. Finally, based on the sub-element technique, the study designs a controllable frequency response for two intersecting signals and miniaturization of patch based crossovers. Two examples are implemented, manufactured and measured to justify the validity of the sub-element technology. In addition, the design steps of this method are simplified compared with relying on full-wave simulations entirely.
               
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