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Epoxy Composites Reinforced With Almond Shell and Date Seed Particles: Mechanical Properties, Machinability, Conductivity, Thermal Stability, and Stress Analysis

Nowadays, much emphasis is placed on bio-based materials, which are suitable for the environment and help reduce chemical-based materials’ usage. These biomaterials can replace fossil fuels and increase applications by… Click to show full abstract

Nowadays, much emphasis is placed on bio-based materials, which are suitable for the environment and help reduce chemical-based materials’ usage. These biomaterials can replace fossil fuels and increase applications by enhancing their mechanical properties. This study uses almond shells (ASs) and date seed (DS) particles as filler material. They are widely available as a byproduct and are disposed of as agricultural waste. Filler particles are reinforced in the epoxy matrix, a thermosetting resin with many outstanding features. Fillers are added based on the varying weight percentage in the epoxy monomer. Interestingly, this filler reinforcement enhances mechanical properties; a 42.86% increase in tensile strength and a 32.14% increase in flexural strength are noted. However, the hardness of composites reduces with the addition of filler. The insulating property of composites is elevated. Thermogravimetric analysis shows that composites will not be degraded and can sustain higher temperatures. The heat deflection temperature (HDT) test confirms that composites gain more rigidity by adding filler. Glass transition temperature is elevated to 8 °C compared to the neat matrix. The machinability of the composites is improved; the machining time is reduced, and hence, greater machining efficiency is obtained for the composites. In addition, a finite element analysis (FEA) is performed for calculating Von Mises stress with the properties of composites.

Keywords: mechanical properties; seed; seed particles; almond; analysis; date seed

Journal Title: IEEE Transactions on Dielectrics and Electrical Insulation
Year Published: 2025

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