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Ultra-Stable Sintered Silver Die Attach for Demanding High-Power/Temperature Applications

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A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing… Click to show full abstract

A novel and simple processing step has been demonstrated to produce thermally stable sintered silver nanoparticles structures. Sintered silver has been investigated as a die attach to resolve the long-standing demand for a reliable material to enable high-power/temperature electronics operating above 300 °C. However, it is now a well-known fact that such materials undergo massive microstructural evolution at 250 °C and above, creating doubts about their long-term reliability. Here, an additional processing step utilizing oxidizing treatment is demonstrated to immobilize the silver atoms through formation of Ag2O. This technique stabilizes sintered silver up to 400 °C, taking advantage of the open-pore network to facilitate treatment deep in the material interior.

Keywords: high power; stable sintered; power temperature; die attach; sintered silver; silver

Journal Title: IEEE Transactions on Device and Materials Reliability
Year Published: 2017

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