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Analysis of Hump Effect Induced by Positive Bias Temperature Instability in the Local Oxidation of Silicon n-MOSFETs

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In this study, the degradation of the subthreshold swing (S.S.) and the hump effect are observed in the local oxidation of silicon (LOCOS) metal-oxide-semiconductor field-effect transistors (MOSFETs) under short- and… Click to show full abstract

In this study, the degradation of the subthreshold swing (S.S.) and the hump effect are observed in the local oxidation of silicon (LOCOS) metal-oxide-semiconductor field-effect transistors (MOSFETs) under short- and long-term positive bias temperature instability tests, respectively. S.S. collapse is considered to be caused by anode hot-hole injection, and the hump effect occurs because the geometric structure from LOCOS isolation forms parasitic transistors on both sides of the channel, which can be verified by a Silvaco Technology computer-aided design (TCAD) simulation. In addition, the body effect measurement method is proposed to elucidate the mechanism of the hump effect for further confirmation of hump formation.

Keywords: effect; hump effect; local oxidation; oxidation silicon; positive bias

Journal Title: IEEE Transactions on Device and Materials Reliability
Year Published: 2023

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