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Power module packaging technologies are undergoing extensive changes to satisfy compact high-power-density systems. The advantages of double-sided cooling power module in thermal and electrical compared to wire-bonding are summarized. Some… Click to show full abstract
Power module packaging technologies are undergoing extensive changes to satisfy compact high-power-density systems. The advantages of double-sided cooling power module in thermal and electrical compared to wire-bonding are summarized. Some typical double-sided cooling power modules developed by institutes or companies are introduced in detail. The challenges and future trends of double-sided cooling power modules are also highlighted.
Keywords:
sided cooling;
cooling power;
power;
review double;
power modules;
double sided
Journal Title: IEEE Transactions on Device and Materials Reliability
Year Published: 2023
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Journal Title: IEEE Transactions on Device and Materials Reliability
Year Published: 2023
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!