The march toward dimensional scaling and higher performance has led the semiconductor industry to consider nonplanar topologies and different material systems. These choices have led to an increase in the… Click to show full abstract
The march toward dimensional scaling and higher performance has led the semiconductor industry to consider nonplanar topologies and different material systems. These choices have led to an increase in the local power dissipation and, correspondingly, a rise in the local self-heating (SH). This article is a review of the history and trends of SH effects, the characterization techniques thereof, and the manifestations, sensitivities, and impacts of this heating on reliability mechanisms. Future pathways are also highlighted to indicate the challenges that exist for CMOS technologies.
               
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