Vacuum ultraviolet-absorption spectroscopy (AS) and emission spectroscopy (ES) from delocalized probe plasma are implemented in the downstream chamber of a soft-etch industrial plasma reactor. A capacitively coupled plasma plasma, running… Click to show full abstract
Vacuum ultraviolet-absorption spectroscopy (AS) and emission spectroscopy (ES) from delocalized probe plasma are implemented in the downstream chamber of a soft-etch industrial plasma reactor. A capacitively coupled plasma plasma, running in the upper compartment in He/NF3/NH3/H2 mixtures at about 1 Torr, produces reactive species which flow through a shower head into a downstream chamber, where they can etch different μ-electronic materials: Si, SiO2, SiN, etc. The ES reveals the presence of F atoms, while the dissociation rates of NF3 and NH3 are deduced from the AS, as well as the density of HF molecules, produced by chemical chain-reactions between dissociation products of NF3, NH3, and H2. The variations of HF density as a function of the NH3 flow rate suggest the possible formation of NH4F molecules in the plasma.
               
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