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To solve the problems of low efficiency and high void rate in the process of the MEMS filter (die) attach and increase the strength of wire bonding between the die… Click to show full abstract
To solve the problems of low efficiency and high void rate in the process of the MEMS filter (die) attach and increase the strength of wire bonding between the die and microwave circuit board, plas...
Keywords:
mems filter;
application plasma;
plasma cleaning;
process mems;
cleaning process
Journal Title: Modern Physics Letters B
Year Published: 2020
Link to full text (if available)
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Journal Title: Modern Physics Letters B
Year Published: 2020
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!