The present paper deals with the problem of thermoelastic interactions in a homogeneous, isotropic three-dimensional medium whose surface suffers a time dependent thermal loading. The problem is treated on the… Click to show full abstract
The present paper deals with the problem of thermoelastic interactions in a homogeneous, isotropic three-dimensional medium whose surface suffers a time dependent thermal loading. The problem is treated on the basis of three-phase-lag model and dual-phase-lag model with two temperatures. The medium is assumed to be unstressed initially and has uniform temperature. Normal mode analysis technique is employed onto the non-dimensional field equations to derive the exact expressions for displacement component, conductive temperature, thermodynamic temperature, stress and strain. The problem is illustrated by computing the numerical values of the field variables for a copper material. Finally, all the physical fields are represented graphically to analyze the difference between the two models. The effect of the two temperature parameter is also discussed.
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