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The 3D integrated circuits are enlarging the technology with lots of potentials which establish vertical interconnection between different dies or layers. In 3D-integrated circuit fabrication, cong... Click to show full abstract
The 3D integrated circuits are enlarging the technology with lots of potentials which establish vertical interconnection between different dies or layers. In 3D-integrated circuit fabrication, cong...
Keywords:
integrated circuits;
partitioning based;
optimization approach;
based place;
approach partitioning;
novel optimization
Journal Title: International Journal of Electrical Engineering Education
Year Published: 2020
Link to full text (if available)
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Journal Title: International Journal of Electrical Engineering Education
Year Published: 2020
Link to full text (if available)
Share on Social Media: Sign Up to like & get
recommendations!