LAUSR

We present a method for the selective etching of borosilicate glass (SCHOTT Borofloat 33), in which we modify the glass with an ultrashort pulse laser and subsequent wet chemical etching. The BF33 glass is often used in microtechnology to produce sensors, actors, and fluidic chips as it can be bonded to silicon wafers by anodic bonding. The glass is irradiated and modified by circular polarized laser light with a wavelength of 1030 nm. By etching the glass with potassium hydroxide, the modified material can be removed. In this study, the selectivity was analyzed dependent on the laser parameters pulse repetition rate, pulse duration, writing speeds, and pulse energy. A selectivity up to 540 could be observed in this study. Finally, the manufacturing capabilities for three-dimensional free form shapes in BF33 are demonstrated and compared with fused silica.