LAUSR

This paper describes an investigation of the possibility of using a new conductive ink, instead of copper clad laminates, in the manufacturing of microstrip patch antennas on glass and fiberglass substrates and of FSS bioinspired on fiberglass substrate, for wireless communication systems. The new conductive ink is developed using synthesized nitrocellulose, which, in ethyl acetate solution, works as bonding agent and carrier for the formation of a conductive film. The load used in the fabrication process is silver metallic powder. Simulation and analysis are performed using Ansoft Designer software. Microstrip antenna and FSS prototypes are fabricated and measured for comparison purpose. Agreement is observed between simulation and measurements results.