In this paper, we propose a new method for double sided diffusion of lithium ions into a monocrystalline silicon wafer for the further fabrication of Si (Li) p-i-n nuclear radiation… Click to show full abstract
In this paper, we propose a new method for double sided diffusion of lithium ions into a monocrystalline silicon wafer for the further fabrication of Si (Li) p-i-n nuclear radiation detectors with a diameter of the sensitive surface of more than 110 mm and a thickness of the sensitive region of more than 4 mm. It was found that the optimal regime for lithium diffusion into large-diameter silicon is at a temperature of T (450 20) C, time t 3 min, thickness hLi (300 10) mm. The theoretical assumptions and experimental characteristics of double sided diffusion are considered. As initial material the dislocation free monocrystalline cylindrical silicon crystal of the p-type, obtained by the floating-zone method (with a diameter 110 mm, thickness 8-10 mm, resistivity 1000 ÷ 10000 Ohm·cm and life time τ 500 s) and the silicon crystal of the p-type (with a diameter of 110 mm, resistivity 10 ÷ 12 Ohm·cm, lifetime τ 50 s, grown in an argon atmosphere) obtained by the Czochralski method were used. Correspondingly, the technological processes of mechanical and chemical processing of semiconductor wafers based on silicon of a large area have been improved.
               
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