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Exploring the Interfacial Reaction of Nano Al/CuO Energetic Films through Thermal Analysis and Ab Initio Molecular Dynamics Simulation

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The effect of the interface layer on energy release in nanoenergetic composite films is important and challenging for the utilization of energy. Nano Al/CuO composite films with different modulation periods… Click to show full abstract

The effect of the interface layer on energy release in nanoenergetic composite films is important and challenging for the utilization of energy. Nano Al/CuO composite films with different modulation periods were prepared by magnetron sputtering and tested by differential scanning calorimetry. With the increase in the modulation period of the nano Al/CuO energetic composite films, the interface layer contained in the energetic composite film decreased meaningfully, increasing the total heat release meaningfully. Ab initio molecular dynamics (AIMD) simulation were carried out to study the preparation process changes and related properties of the nano Al/CuO energetic composite films under different configurations at 400 K. The results showed that the diffusion of oxygen atoms first occurred at the upper and lower interfaces of CuO and Al, forming AlOx and CuxAlyOz. The two-modulation-period structure changed more obviously than the one-modulation-period structure, and the reaction was faster. The propagation rate and reaction duration of the front end of the diffusion reaction fronts at the upper and lower interfaces were different. The Helmholtz free energy loss of the nano Al/CuO composite films with a two-modulation-period configuration was large, and the number of interfacial layers had a great influence on the Helmholtz free energy, which was consistent with the results of the thermal analysis. Current molecular dynamics studies may provide new insights into the nature and characteristics of fast thermite reactions in atomic detail.

Keywords: reaction; molecular dynamics; nano cuo; composite films; cuo energetic

Journal Title: Molecules
Year Published: 2022

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