LAUSR

Given the thermal management problem aroused by increasing power densities of electronic components in the system, graphene-based papers have raised considerable interest for applications as thermal interface materials (TIMs) to solve interfacial heat transfer issues. Significant research efforts have focused on enhancing the through-plane thermal conductivity of graphene paper; however, for practical thermal management applications, reducing the thermal contact resistance between graphene paper and the mating surface is also a challenge to be addressed. Here, a strategy aimed at reducing the thermal contact resistance between graphene paper and the mating surface to realize enhanced heat dissipation was demonstrated. For this, graphene paper was decorated with polydopamine EGaIn nanocapsules using a facile dip-coating process. In practical TIM application, there was a decrease in the thermal contact resistance between the TIMs and mating surface after decoration (from 46 to 15 K mm2 W−1), which enabled the decorated paper to realize a 26% enhancement of cooling efficiency compared with the case without decoration. This demonstrated that this method is a promising route to enhance the heat dissipation capacity of graphene-based TIMs for practical electronic cooling applications.