LAUSR

With the rapid development of high-frequency communication and large-scale integrated circuits, insulating dielectric materials require a low dielectric constant and dielectric loss. Poly (aryl ether ketone) resins (PAEK) have garnered considerable attention as an intriguing class of engineering thermoplastics possessing excellent chemical and thermal properties. However, the high permittivity of PAEK becomes an obstacle to its application in the field of high-frequency communication and large-scale integrated circuits. Therefore, reducing the dielectric constant and dielectric loss of PAEK while maintaining its excellent performance is critical to expanding the PAEK applications mentioned above. This study synthesized a series of poly (aryl ether ketone) resins that are low dielectric, highly thermally resistant, and soluble, containing cyclohexyl and diphenyl fluorene. The effects of cyclohexyl contents on the properties of a PAEK resin were studied systematically. The results showed that weakly-polarized cyclohexyl could reduce the molecular polarization of PAEK, resulting in low permittivity and high transmittance. The permittivity of PAEK is 2.95–3.26@10GHz, and the transmittance is 65–85%. In addition, the resin has excellent solubility and can be dissolved in NMP, DMF, DMAc, and other solvents at room temperature. Furthermore, cyclohexyl provided PAEK with excellent thermal properties, including a glass transition temperature of 239–245 °C and a 5% thermogravimetric temperature, under a nitrogen atmosphere of 469–534 °C. This makes it a promising candidate for use in high-frequency communications and large-scale integrated circuits.