Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints
Sign Up to like & getrecommendations! Published in 2017 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-017-7360-1
Abstract: Thermal aging effects on the tensile and fatigue properties of Sn-3.0Ag-0.5Cu (wt%, SAC305) solder joint are investigated. Three series of experiments were conducted at different temperatures, including uniaxial tension experiments for specimens after aging for… read more here.
Keywords: tensile strength; temperature; 0ag 5cu; solder joints ... See more keywords
Annealing effect to constitutive behavior of Sn–3.0Ag–0.5Cu solder
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-8705-0
Abstract: Sn–Ag–Cu based solder alloys are replacing Sn–Pb solders in electronic packaging structures of commercial electric devices. In order to evaluate the structural reliability, the mechanical property of solder material is critical to the numerical simulations.… read more here.
Keywords: annealing process; 0ag 5cu; solder material; annealing effect ... See more keywords
Electrochemical migration behavior of Sn–3.0Ag–0.5Cu solder alloy under SO2 polluted thin electrolyte layers
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-00858-4
Abstract: The effect of HSO3− on the electrochemical migration (ECM) of Sn–3.0Ag–0.5Cu lead-free solder alloy under thin electrolyte layers was investigated using the thin electrolyte layer method. The results showed that the migration element of Sn–3.0Ag–0.5Cu… read more here.
Keywords: electrolyte layers; alloy; 0ag 5cu; thin electrolyte ... See more keywords
Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Electronic Materials"
DOI: 10.1007/s11664-018-06865-1
Abstract: Eutectic Sn58Bi (SnBi) solder paste mixed with 0 wt.%, 3 wt.%, 5 wt.%, 8 wt.% and 15 wt.% of Sn-3.0Ag-0.5Cu (SAC) paste was prepared by mechanical mixing. The effects of SAC paste additions on the microstructure evolution of SnBi-SAC/Cu composite… read more here.
Keywords: 0ag 5cu; solder paste; paste; sac ... See more keywords
Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints
Sign Up to like & getrecommendations! Published in 2020 at "Applied Surface Science"
DOI: 10.1016/j.apsusc.2019.144339
Abstract: Abstract Herein, we investigated the interfacial reactions of crystalline Pd (pure Pd) and amorphous Pd (Pd(P)) layers in thin electroless-Ni electroless-Pd immersion-Au (thin-ENEPIG) surface-finished printed circuit board with Sn-3.0Ag-0.5Cu (SAC305) solder joints reflowed at 260 °C… read more here.
Keywords: interfacial reactions; pure; 0ag 5cu; solder joints ... See more keywords
Corrosion behavior of Sn-3.0Ag-0.5Cu alloy under chlorine-containing thin electrolyte layers
Sign Up to like & getrecommendations! Published in 2018 at "Corrosion Science"
DOI: 10.1016/j.corsci.2018.08.041
Abstract: Abstract Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder alloy under chlorine-containing thin electrolyte layers is studied. The emphasis is laid on discussion about influences of addition of alloying elements, concentration of chloride ion and thickness of… read more here.
Keywords: 0ag 5cu; alloy chlorine; behavior 0ag; corrosion ... See more keywords
Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2019.07.184
Abstract: Abstract We investigated the interfacial reactions and mechanical reliabilities of different Ni layer thicknesses and P-containing Pd layers in thin electroless-Ni electroless-Pd immersion gold (thin-Au/Pd(P)/Ni(P)) surface-finished printed circuit board (PCBs) with Sn-3.0Ag-0.5Cu (SAC 305) solder… read more here.
Keywords: thin surface; layer; solder joints; 0ag 5cu ... See more keywords
Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature
Sign Up to like & getrecommendations! Published in 2020 at "Microelectronics Reliability"
DOI: 10.1016/j.microrel.2019.113555
Abstract: Abstract The mechanical quality of solder joints plays an important role in determining the structural integrity of electronic interconnects. In this work, we study the annealing effects on the tensile deformation and microstructure of Sn-3.0Ag-0.5Cu… read more here.
Keywords: temperature; 0ag 5cu; solder joints; tensile deformation ... See more keywords