The influences of Ag nanoparticles on voids growth and solderability about Sn3.0Ag0.5Cu/Cu solder joint
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DOI: 10.1088/2053-1591/ad4197
Abstract: Although Sn3.0Ag0.5Cu solder (SAC305) has higher reliability, there are a large number of harmful voids in solder joints. Larger voids can reduce thermal conductivity of solder joints. However, as a microstructure growth inhibitor, the influences… read more here.
Keywords: sn3 0ag0; 0ag0 5cu; solder; voids growth ... See more keywords