High impact reliability and high temperature performance of Fe and Bi added Sn-1Ag-0.5Cu solder alloys
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DOI: 10.1007/s10854-017-6412-x
Abstract: In this paper, the impact performance of the novel Fe and Bi added Sn-1Ag-0.5Cu solders has been thoroughly evaluated under severe thermal aging at 200 °C temperature for 100, 200 and 300 h. Impact absorbed energy was… read more here.
Keywords: microscopy; impact; 1ag 5cu; solder alloys ... See more keywords