Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-02655-5
Abstract: In soldering process, oxygen trapped in solder often leads to reliability issues. In order to determine basic mechanisms, five commercial Au-20Sn solder preforms with different oxygen content were studied. The XPS results revealed that the… read more here.
Keywords: oxygen; solder joints; 20sn solder; solder ... See more keywords
The impact of oxygen content on the reliability of Au-20Sn solder hermetic package
Sign Up to like & getrecommendations! Published in 2020 at "Vacuum"
DOI: 10.1016/j.vacuum.2020.109754
Abstract: Abstract Hermetic sealing devices are produced with Au-20Sn solder at different oxygen content levels to study the reliability of the seal joints. Cross section of Au-20Sn solder joints processed with different oxygen content were examined… read more here.
Keywords: reliability; oxygen; 20sn solder; oxygen content ... See more keywords