Integration, BEOL, and Thermal Stress Impact on CMOS-Compatible Titanium-Based Contacts for III–V Devices on a 300-mm Platform
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DOI: 10.1109/ted.2020.2985766
Abstract: Titanium-based contacts are envisioned for the integration of III–V device contacts on a 300-mm platform, such as photodetectors, semiconductor optical amplifiers (SOAs), and III–V silicon hybrid lasers. For the first time, the impact of the… read more here.
Keywords: titanium based; based contacts; integration; thermal stress ... See more keywords