Growth behavior of IMCs layer of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu substrates during aging
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-0423-0
Abstract: In this work, the interfacial reactions and IMC growth of the Sn–35Bi–1Ag on Cu, Ni–P/Cu and Ni–Co–P/Cu were studied during reflowing at 220 °C for 10 min and solid–state treatment at 150 °C with various aging times. For… read more here.
Keywords: layer; electroless plating; 35bi 1ag; plating layer ... See more keywords
Effect of temperature and substrate surface roughness on wetting behavior and interfacial structure between Sn–35Bi–1Ag solder and Cu substrate
Sign Up to like & getrecommendations! Published in 2020 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-020-02975-x
Abstract: The effects of peak temperature (483 K and 533 K) and substrate surface roughness on wetting characteristics and interfacial structure between Sn–35Bi–1Ag solder and Cu substrates were studied. Results revealed that the wettability of Sn–35Bi–1Ag solder was… read more here.
Keywords: topography; surface roughness; surface; 35bi 1ag ... See more keywords