Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
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DOI: 10.1007/s11664-018-6744-1
Abstract: The reliability of solder joints is affected significantly by thermomechanical properties such as creep and thermal fatigue. In this work, the creep of directionally solidified (DS) Sn-3Ag-0.5Cu wt.% (SAC305) dog-bone samples (gauge dimension: 10 × 2 × 1.5 mm) with… read more here.
Keywords: 3ag 5cu; evaluating creep; deformation; solder ... See more keywords
Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging
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DOI: 10.1007/s11664-020-08523-x
Abstract: The wettability and growth of intermetallic compounds (IMCs) of stud bump materials Ag, Ag-4Pd, Cu, and Au with Sn-3Ag-0.5Cu (SAC305) solder have been investigated. Stud bumps produced using wire bonding techniques are widely employed in… read more here.
Keywords: 3ag 5cu; stud bumps; 4pd stud; flip chip ... See more keywords
Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures
Sign Up to like & getrecommendations! Published in 2019 at "Journal of Alloys and Compounds"
DOI: 10.1016/j.jallcom.2019.05.295
Abstract: Abstract During deep space exploration, electronic devices will be inevitably exposed to cryogenic temperatures. The effects of cryogenic temperature storage on the interfacial microstructure and mechanical behaviors of Sn-3Ag-0.5Cu/Cu (SAC305/Cu) solder joints were systematically investigated.… read more here.
Keywords: cryogenic temperatures; growth; solder joints; solder ... See more keywords