Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging
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DOI: 10.1007/s11664-020-08523-x
Abstract: The wettability and growth of intermetallic compounds (IMCs) of stud bump materials Ag, Ag-4Pd, Cu, and Au with Sn-3Ag-0.5Cu (SAC305) solder have been investigated. Stud bumps produced using wire bonding techniques are widely employed in… read more here.
Keywords: 3ag 5cu; stud bumps; 4pd stud; flip chip ... See more keywords