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Published in 2019 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-019-02444-0
Abstract: Al–50Si alloys for electronic packaging were prepared by gas atomization following hot press sintering, and the influences of adding minor Sc (0.3%) on microstructure and mechanical and thermo-physical properties were studied. The Si phase exhibits…
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Keywords:
electronic packaging;
alloys electronic;
50si alloy;
50si alloys ... See more keywords