Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint
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DOI: 10.1007/s10854-019-02563-8
Abstract: Ag sinter joining provides superior mechanical and thermal/electrical properties and is considered to become a leading next-generation wide band-gap (WBG) die-attach material. However, the microstructural evolution and mechanical characteristics of Ag sinter joining when subjected… read more here.
Keywords: 5sn solder; sinter; dba; thermal aging ... See more keywords