Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound
Sign Up to like & getrecommendations! Published in 2019 at "Scripta Materialia"
DOI: 10.1016/j.scriptamat.2018.08.020
Abstract: Abstract The present study has succeeded in direct determination of the location of dopant Ni atoms in η-(Cu,Ni)6Sn5 by aberration-corrected scanning transmission electron microscopy (STEM) including atomic-resolution imaging as well as elemental mapping by X-ray… read more here.
Keywords: atomic resolution; intermetallic compound; locations doped; atom locations ... See more keywords
Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process.
Sign Up to like & getrecommendations! Published in 2018 at "Ultrasonics sonochemistry"
DOI: 10.1016/j.ultsonch.2017.12.005
Abstract: Homogeneous (Cu, Ni)6Sn5 intermetallic compound (IMC) joints were rapidly formed in asymmetrical Ni/Sn/Cu system by an ultrasound-induced transient liquid phase (TLP) soldering process. In the traditional TLP soldering process, the intermetallic joints formed in Ni/Sn/Cu… read more here.
Keywords: homogeneous 6sn5; 6sn5 intermetallic; system; ultrasound induced ... See more keywords