Study on the microstructure and properties of low-Ag Sn–0.3Ag–0.7Cu–0.5Ga solder alloys bearing Pr
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DOI: 10.1007/s10854-017-6537-y
Abstract: Effect of Pr element on the wettability, microstructure, interface morphology and mechanical property of Sn–0.3Ag–0.7Cu–0.5Ga–xPr solder has been studied. The result exhibits that the wettability of solders could significantly be improved by adding an approximate… read more here.
Keywords: 7cu 5ga; study microstructure; 3ag 7cu; microstructure properties ... See more keywords