Effect of Ni Addition to Sn0.7Cu Solder Alloy on Thermal Behavior, Microstructure, and Mechanical Properties
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DOI: 10.1007/s11665-018-3734-7
Abstract: The addition of Ni on lead-free solder alloys Sn0.7Cu was tested in this study. A small amount of Ni was added to the solder alloys to evaluate the thermal behavior, microstructure, and mechanical properties of… read more here.
Keywords: 7cu solder; addition; solder; solder alloys ... See more keywords