Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders
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DOI: 10.1007/s11664-018-6786-4
Abstract: Printed circuit boards that use fine pitch technology have a greater risk of open-circuit failure, due to void formations caused by the growth of intermetallic compounds. This failure mode is reported to be a result… read more here.
Keywords: imc growth; electromigration; intermetallic compounds; thermomigration ... See more keywords