Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
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DOI: 10.3390/ma16051852
Abstract: This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a… read more here.
Keywords: sn0 7cu0; whisker growth; 05ni solder; 7cu0 05ni ... See more keywords