Microstructure, interfacial IMC layer and mechanical properties of Cu/Sn-9Zn-xZrC/Cu solder joints
Sign Up to like & getrecommendations! Published in 2018 at "Materials Research Express"
DOI: 10.1088/2053-1591/aacd97
Abstract: The effect of trace ZrC on the wettability, microstructure and mechanical properties of Sn-9Zn composite solder alloy joints was investigated. The results indicated that the wettability of the Sn-9Zn based composite solder alloy was improved… read more here.
Keywords: composite solder; solder joints; imc layer; mechanical properties ... See more keywords