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Published in 2019 at "International Journal of Adhesion and Adhesives"
DOI: 10.1016/j.ijadhadh.2019.01.018
Abstract: Abstract To minimize the structure distortion and potential de-bonding in adhesive bonding of dissimilar materials (e.g., metals and polymeric composites), a two-component (2 K) low temperature cure modified adhesive consisting of 93.5 wt% commercial Henkel 5089 adhesive,…
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Keywords:
pa6 pa6;
modified adhesive;
pa6;
min ... See more keywords