Accelerated Metastable Solid–liquid Interdiffusion Bonding with High Thermal Stability and Power Handling
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DOI: 10.1007/s11664-017-5779-z
Abstract: Emerging high-performance systems are driving the need for advanced packaging solutions such as 3-D integrated circuits (ICs) and 2.5-D system integration with increasing performance and reliability requirements for off-chip interconnections. Solid–liquid interdiffusion (SLID) bonding resulting… read more here.
Keywords: accelerated metastable; liquid interdiffusion; thermal stability; solid liquid ... See more keywords