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Accurate Inductance Modeling of 3-D Inductor Based on TSV

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1 Published in 2018 at "IEEE Microwave and Wireless Components Letters"

DOI: 10.1109/lmwc.2018.2867089

Abstract: In this letter, an accurate model for the inductance of 3-D integrated inductor based on through silicon via is proposed. The model, considering both the internal inductance and detailed calculation of redistribution layer inductance, can… read more here.

Keywords: accurate inductance; inductance; model; inductor ... See more keywords