A novel photocurable modified epoxy resin for high heat resistance coatings
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DOI: 10.1007/s00396-020-04708-2
Abstract: In this paper, in order to further improve the heat resistance of UV-curing epoxy cresol novolac (EOCN), 2,2-bis(hydroxymethyl)propionic acid (DMPA) was firstly introduced to open epoxy groups in EOCN and then the hydroxyl groups reacted… read more here.
Keywords: resin; heat resistance; acryloyl chloride; group ... See more keywords