Modeling and Controlling Layout Dependent Variations in Semi-Additive Copper Electrochemical Plating
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DOI: 10.1109/tsm.2019.2941439
Abstract: An empirical model is proposed for predicting layout dependent thickness variations in the semi-additive copper electrochemical plating (ECP) process. These variations are believed to be caused by the uneven depletion of copper sulfate during plating,… read more here.
Keywords: variations semi; semi additive; copper; layout dependent ... See more keywords