Optimization of Additive and Current Conditions for Void-Free Filled Through-Silicon Via
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DOI: 10.3390/app8112135
Abstract: Studies of through-silicon vias (TSVs) have become important owing to the increasing demand for 3D packaging. To obtain high-performance devices, it is important to fill the holes inside TSVs without voids. In this study, poly(ethylene… read more here.
Keywords: current conditions; conditions void; additive current; free filled ... See more keywords