Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints
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DOI: 10.1016/j.engfracmech.2017.09.027
Abstract: Abstract Fracture experiments with ball grid array (BGA) specimens having different adherend rigidities were performed under bending loads at intermediate strain rates (0.2–1 s−1) and a high strain rate of 30 s−1. A cohesive zone model (CZM)… read more here.
Keywords: adherend stiffness; fracture; solder joints; strain rate ... See more keywords