A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
Sign Up to like & getrecommendations! Published in 2021 at "Intermetallics"
DOI: 10.1016/j.intermet.2021.107342
Abstract: Abstract Three-dimensional integrated circuits provide a promising approach to extend Moore's law by vertically stacking multiple functional chips with microbumps. However, with miniaturization, depletion of the wetting layer of under bump metallurgy becomes a worrisome… read more here.
Keywords: wetting layer; terminal stage; intermetallics adhesion; adhesion layer ... See more keywords
A comparison of metal adhesion layers for Au films in thermo-plasmonic applications.
Sign Up to like & getrecommendations! Published in 2020 at "ACS applied materials & interfaces"
DOI: 10.1021/acsami.9b22279
Abstract: If thermo-plasmonic applications such as heat-assisted magnetic recording (HAMR) are to be commercially viable, it is necessary to optimize both the thermal stability and plasmonic performance of the devices involved. In this work, a variety… read more here.
Keywords: adhesion layers; plasmonic applications; thermo plasmonic; adhesion ... See more keywords
Adhesion layer influence on controlling the local temperature in plasmonic gold nanoholes.
Sign Up to like & getrecommendations! Published in 2020 at "Nanoscale"
DOI: 10.1039/c9nr08113e
Abstract: Gold films do not adhere well on glass substrates, so plasmonics experiments typically use a thin adhesion layer of titanium or chromium to ensure a proper adhesion between the gold film and the glass substrate.… read more here.
Keywords: local temperature; gold; temperature; adhesion layer ... See more keywords
Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps
Sign Up to like & getrecommendations! Published in 2022 at "Materials"
DOI: 10.3390/ma15124297
Abstract: The use of scaled-down micro-bumps in miniaturized consumer electronic products has led to the easy realization of full intermetallic solder bumps owing to the completion of the wetting layer. However, the direct contact of the… read more here.
Keywords: reaction; adhesion; adhesion layer; micro bumps ... See more keywords