Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic-Sintered Copper Membrane for Printed Flexible Hybrid Electronics.
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DOI: 10.1021/acsami.8b17164
Abstract: Inkjet-printed electronics using metal particles typically lack electrical conductivity and interfacial adhesion with an underlying substrate. To address the inherent issues of printed materials, this Research Article introduces advanced materials and processing methodologies. Enhanced adhesion… read more here.
Keywords: adhesion nanostructured; flexible hybrid; adhesion; conductivity ... See more keywords