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Published in 2021 at "Colloids and Surfaces A: Physicochemical and Engineering Aspects"
DOI: 10.1016/j.colsurfa.2021.126907
Abstract: Abstract Adhesive sintered Cu nanoparticles (NPs) with low resistivity (41.0 µΩ cm) were formed on polyimide (PI) substrates using well-dispersed Cu NP inks containing polyvinylpyrrolidone (PVP), and their flexibilities were improved by combining the Cu…
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Keywords:
polyvinylpyrrolidone;
pvp;
flexible adhesive;
adhesive sintered ... See more keywords