Light enhanced direct Cu bonding for advanced electronic assembly
Sign Up to like & getrecommendations! Published in 2018 at "Journal of Materials Science: Materials in Electronics"
DOI: 10.1007/s10854-018-9547-5
Abstract: An innovative and efficient surface modification pre-treatment that enhances Cu–Cu direct bonding through electromagnetic irradiation, including pulsed Xenon flash and near infrared rays is proposed. Without vacuum, short but critical electromagnetic radiation exposure on faying… read more here.
Keywords: electronic assembly; enhanced direct; direct bonding; light enhanced ... See more keywords
Advanced Electronic and Optoelectronic Sensors, Applications, Modelling and Industry 5.0 Perspectives
Sign Up to like & getrecommendations! Published in 2023 at "Applied Sciences"
DOI: 10.3390/app13074582
Abstract: This review will focus on advances in electronic and optoelectronic technologies by through the analysis of a full research and industrial application scenario. Starting with the analysis of nanocomposite sensors, and electronic/optoelectronic/mechatronic systems, the review… read more here.
Keywords: advanced electronic; perspectives advanced; production; industry ... See more keywords