Understanding Microstructural Properties of AlxCrCoFeNiCu High Entropy Alloy by Advanced Scanning Transmission Electron Microscopy
Sign Up to like & getrecommendations! Published in 2019 at "Microscopy and Microanalysis"
DOI: 10.1017/s1431927619013710
Abstract: High Entropy Alloys (HEAs) such as AlxCrCoFeNiCu, typically consist of five or more alloying constituents in equal or nearly-equal concentrations and are a class of materials with extraordinary mechanical properties [1, 2]. The structural and… read more here.
Keywords: microscopy; transmission electron; scanning transmission; advanced scanning ... See more keywords
Strain Distribution Induced in SOI Photonic Substrate by Through Silicon via Using Advanced Scanning X-Ray Nano-Diffraction
Sign Up to like & getrecommendations! Published in 2018 at "IEEE Transactions on Device and Materials Reliability"
DOI: 10.1109/tdmr.2018.2881418
Abstract: In 3-D integration, dice are vertically interconnected with through silicon via (TSV), which consist of holes etched in a thinned silicon substrate and filled with copper. This process induces thermal strain in surrounding silicon. New… read more here.
Keywords: silicon via; using advanced; advanced scanning; silicon ... See more keywords